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Thailand acdc power module potting requirements(1)


module power supply

A modular power supply is a power supply that can be directly mounted on a printed circuit board and can be used for application-specific integrated circuits (ASICs), digital signal processors (DSPs), microprocessors, memories, field programmable gate arrays (FPGAs) and other Digital or analog loads provide power. Typically, such modules are referred to as load (POL) power supply systems or point-of-use power supply systems (PUPS). Due to the obvious advantages of the modular structure, modular power supplies are widely used in switching equipment, access equipment, mobile communications, microwave communications, optical transmission, routers and other communications fields, as well as automotive electronics, aerospace, etc.

The potting of the acdc power module is very important. This process not only involves the protection of the power module potting acdc power module (waterproof, moisture-proof, dust-proof, anti-corrosion, etc.), but also involves the protection of the power module. thermal design.

Commonly used power module potting materials are divided into three categories: epoxy resin, polyurethane and silicone rubber

Epoxies cannot be used for stress-sensitive and module sealing due to their hardness and are basically eliminated by module power supplies. However, due to its low cost, this epoxy is still used in cost-sensitive micropower supplies. Some domestic bad Marine boost/buck voltage power supply manufacturers also use this epoxy resin acdc Marine boost/buck voltage power supply module. However, due to stress problems, the failure rate of this Marine boost/buck voltage power supply is very high, and buyers are miserable.